FLASH MEMORY

NAND

nand image
Features The NAND flash memory is a type of non-volatile storage technology that does not require any power to retain data. The NAND flash memory is mainly used in devices that require a large amount of storage space such as Digital Cameras, MP3 players, USB drivers and so on. All ESSENCORE NAND components and products are tested and produced in accordance with a strict quality control process for the best performance and stable operation. ESSENCORE, a company which has accumulated considerable know-how in the memory field, is here to provide you with the best solutions that will guarantee success for your business.
  • TSOP
    The TSOP (Thin-Small Outline Package) is a leadframe-based,
    plastic encapsulated package designed for memory products.
    ESSENCORE TSOP provides users with strong packaging
    choices for all types of applications Due to the thin profile,
    TSOP is suitable for applications in portable electronic
    products, cell phones, and memory modules.

    Specifications

    Type 14nm TLC TSOP
    Package TSOP48
    Density 16GB
    Interface Toggle DDR 200Mbps (Max)
    I/O Speed 200Mb/s
    Vcc/Vccq 3.3V/1.8V
    Type 16nm MLC TSOP
    Package TSOP48
    Density 16GB
    Interface Legacy
    I/O Speed 50MHz
    Vcc/Vccq 3.3V
  • FBGA
    The FBGA (Fine-pitch Ball Grid Array) is a surface mount type PKG that
    has a solder ball array instead of lead on the bottom of the PCB board.
    It is a next-generation memory semiconductor that enables the
    miniaturization, light weight, and high performance of various
    electronic devices and communication.

    Specifications

    Type 14nm TLC fBGA
    Package BGA132
    Density 16GB, 32GB, 64GB
    Interface Toggle DDR 200Mbps (Max)
    I/O Speed 200Mb/s
    Vcc/Vccq 3.3V/1.8V
    Type 3D V3/V4 TLC fBGA
    Package BGA132
    Density 32GB
    Interface Toggle DDR 533Mbps (Max)
    I/O Speed 533Mb/s
    Vcc/Vccq 3.3V/1.8V
  • eMMC
    The eMMC (embedded Multi Media Card) is used for the storage
    memory semiconductor inside mobile devices and supports high
    performance, high endurance and low power consumption.
    Every ESSENCORE eMMC product is fully accorded
    with the JEDEC standard.

    Specifications

    MMC eMMC 5.0 (HS400 Support)
    Package 153 fBGA 11.5 x 13 x 1.0T
    Capacity 8GB, 16GB, 32GB
    Flash 2D MLC / 3D TLC NAND Flash
    Performance
    • · Sequential Write : Up to 24 MB/s
    • · Sequential Read : Up to 235 MB/s
    • · Random Write : Up to 7500 IOPS
    • · Random Read : Up to 7300 IOPS