Business Solutions
Innovative technology of ESSECORE
FLASH MEMORY
NAND
Features
The NAND flash memory is a type of non-volatile storage technology that does not require any power to retain data.
The NAND flash memory is mainly used in devices that require a large amount of storage space such as Digital Cameras, MP3 players, USB drivers and so on.
All ESSENCORE NAND components and products are tested and produced in accordance with a strict quality control process for the best performance and stable operation.
ESSENCORE, a company which has accumulated considerable know-how in the memory field, is here to provide you with the best solutions that will guarantee success for your business.
-
The TSOP (Thin-Small Outline Package) is a leadframe-based,
plastic encapsulated package designed for memory products.
ESSENCORE TSOP provides users with strong packaging
choices for all types of applications Due to the thin profile,
TSOP is suitable for applications in portable electronic
products, cell phones, and memory modules.
Specifications
Type |
14nm TLC TSOP |
Package |
TSOP48 |
Density |
16GB |
Interface |
Toggle DDR 200Mbps (Max) |
I/O Speed |
200Mb/s |
Vcc/Vccq |
3.3V/1.8V |
Type |
16nm MLC TSOP |
Package |
TSOP48 |
Density |
16GB |
Interface |
Legacy |
I/O Speed |
50MHz |
Vcc/Vccq |
3.3V |
-
The FBGA (Fine-pitch Ball Grid Array) is a surface mount type PKG that
has a solder ball array instead of lead on the bottom of the PCB board.
It is a next-generation memory semiconductor that enables the
miniaturization, light weight, and high performance of various
electronic devices and communication.
Specifications
Type |
14nm TLC fBGA |
Package |
BGA132 |
Density |
16GB, 32GB, 64GB |
Interface |
Toggle DDR 200Mbps (Max) |
I/O Speed |
200Mb/s |
Vcc/Vccq |
3.3V/1.8V |
Type |
3D V3/V4 TLC fBGA |
Package |
BGA132 |
Density |
32GB |
Interface |
Toggle DDR 533Mbps (Max) |
I/O Speed |
533Mb/s |
Vcc/Vccq |
3.3V/1.8V |
-
The eMMC (embedded Multi Media Card) is used for the storage
memory semiconductor inside mobile devices and supports high
performance, high endurance and low power consumption.
Every ESSENCORE eMMC product is fully accorded
with the JEDEC standard.
Specifications
MMC |
eMMC 5.0 (HS400 Support) |
Package |
153 fBGA 11.5 x 13 x 1.0T |
Capacity |
8GB, 16GB, 32GB |
Flash |
2D MLC / 3D TLC NAND Flash |
Performance |
- · Sequential Write : Up to 24 MB/s
- · Sequential Read : Up to 235 MB/s
- · Random Write : Up to 7500 IOPS
- · Random Read : Up to 7300 IOPS
|