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Features The NAND flash memory is a type of non-volatile storage technology that does not require any power to retain data. The NAND flash memory is mainly used in devices that require a large amount of storage space such as Digital Cameras, MP3 players, USB drivers and so on. All ESSENCORE NAND components and products are tested and produced in accordance with a strict quality control process for the best performance and stable operation. ESSENCORE, a company which has accumulated considerable know-how in the memory field, is here to provide you with the best solutions that will guarantee success for your business.
  • FBGA
    The FBGA (Fine-pitch Ball Grid Array) is a surface mount type PKG that
    has a solder ball array instead of lead on the bottom of the PCB board.
    It is a next-generation memory semiconductor that enables the
    miniaturization, light weight, and high performance of various
    electronic devices and communication.


    Type 3D TLC/QLC fBGA
    Package fBGA132, fBGA152
    Density 64GB, 128GB, 256GB, 512GB, 1TB
    Interface DDR command interface, x8 bus width
    I/O Speed 1200Mbps, 1600Mbps etc
    • ·Vcc : 2.35V ~ 3.6V
    • ·Vccq : 1.14~1.26V
  • eMMC
    The eMMC (embedded Multi Media Card) is used for the storage
    memory semiconductor inside mobile devices and supports high
    performance, high endurance and low power consumption.
    Every ESSENCORE eMMC product is fully accorded
    with the JEDEC standard.


    Type eMMC 5.1
    Package 153 fBGA 11.5 x 13 x 1.0T
    Density 64GB, 128GB
    Flash 3D TLC NAND Flash
    • · Sequential Write : up to 225MB/s
    • · Sequential Read : up to 265MB/s